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Single Wafer Wet Processing

SSEC, privately held since 1965, manages it's business for the long term, believing the opportunities for the integrated circuit industry is still in it's infancy. SSEC is technologically vertically integrated, providing our customers with leading process, reliability and value.

Recently, SSEC was selected by the International SEMATECH Manufacturing Initiative (ISMI) to become an integral part of its 450 mm prototype program.

All SSEC systems are engineered from the inside out and are configurable according to a customer process, manufacturing and business objectives.

SSEC maintains a fully equipped and staffed process development laboratory. Facilities include all 3300 Series processes for wafers to 300 mm, including heated immersion & heated spray solvent processing, Si and Structured Wafer Wet Etching including Backside and Bevel for metals and film removal, Single- and Double- Sided Cleaning, and complete Photolithographic Processes. Metrology equipment includes KLA particle inspection, Hitachi SEM, Veeco AFM, Automatic Four Point Probing, Elipsometer, Profile, Wafer Thickness Measurement and more.

Headquartered in Horsham, Pennsylvania, SSEC provides customers with outstanding products and services through a global network of direct service locations throughout the United States, Europe and Asia.

 
 


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